Spansion Introduces Innovative Package-On-Package Solution To Reduce Wireless Device Size

Sunnyvale, Calif., -- September 12, 2005

Spansion LLC, the Flash memory venture of AMD (NYSE:AMD) and Fujitsu Limited (TSE:6702), today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to deliver sleek, feature-rich wireless phones, PDAs, digital cameras and MP3 players. Spansion’s new PoP solution vertically combines discrete logic and memory packages for board space savings, lower pin-count, simplified system integration and enhanced performance. As a result, handset manufacturers can accommodate the growing demand for advanced features in their wireless products without having to increase their size and weight.

“As wireless devices become more and more sophisticated, they require Flash memory solutions that offer increased code and data storage in a package that doesn’t increase the form factor of the end product,” said Amir Mashkoori, executive vice president of Spansion’s Wireless Solutions Division. “Just as our initial multi-chip packages helped transform the memory industry by reducing the footprint for system memory, these new PoP solutions represent the next evolution in packaging innovation.”

Spansion’s POP solutions measure approximately 1.4 mm in height and vertically combine a system memory package with a logic chip set package. PoP solutions enable a high degree of flexibility for designers, allowing virtually any POP-enabled memory package to be combined with any PoP-enabled logic chip set in a matter of weeks. PoP solutions also enable high yield utilization of both logic and memory, and simplified test to help reduce time-to-market and maximize cost efficiency.


Read the full press release:
http://www.amd.com/us-en/Corporate/VirtualPressRoom/0,,51_104_543~1009 60,00.html